As industries evolve toward smarter, smaller, and more connected technologies, enclosures are facing new challenges. Design engineers are under pressure to deliver lighter, thinner, and safer enclosures that protect sensitive electronics from harsh environments while still meeting demanding performance standards.
This shift is transforming how gaskets and seals are designed and what materials are being used across key markets such as electric vehicles (EVs), medical devices, energy storage systems (ESS), and data centers.
Check out the extended blog on the Rogers website, The Future of Sealing: How Tomorrow's Applications Are Changing, and the video below to see where enclosures are heading and what will be necessary by the teams designing these enclosures.
*Disclaimer: The Enclosure Institute™ is a free educational resource created by Marian, Inc. and Rogers Corporation to help engineers navigate enclosure sealing with expert guidance.
