Flexible Solutions

Custom Converted Solutions for Electronic Applications

Posted by Brook Girkin

March 4, 2024 1:00 PM

Custom Converted Solutions for Electronic Applications

In the fast-paced world, electronics are now integrated into almost every aspect of human life. Solutions ensuring optimal performance and longevity are necessary to meet consumers’ expectations. Many converted electronic components are made using materials that address various challenges faced by electronics applications, including thermal management, electromagnetic interference (EMI), surface protection, and more.

Take a look below to see some of the custom solutions that enhance performance and function in applications with electronic components.


Thermal Management Solutions

Die-cut Thermal PadsThermal management is essential to prevent electronic components from overheating. These solutions safeguard devices so they maintain optimal operating temperatures, which maximizes performance and prevents damage to the device.

Materials like silicone and acrylic thermal gap pads, thermal transfer tapes, foams, and aluminum, copper, and graphite heat spreaders are commonly converted to custom shapes for an application.

Material suppliers include 3M™, tesa®, Rogers Corporation, Saint-Gobain, NeoGraf™, Parker Chomerics, and Polymer Science.



Mesh/Filters/VentsMesh parts, filters, and vents are incorporated to control airflow, allow sound to pass, and protect electronic components from dust, debris, and moisture while maintaining a clean and functional internal environment.

Adhesives are often laminated to the filter/vent so it can bond to the device while offering proper performance.   

Common materials may include microporous PTFE venting membrane, filter mesh, acoustic mesh/fabric, and porous plastics and fibers. Suppliers include Porex®, Sefar, SAATI, and BOPP.


Electromagnetic interference (EMI) and radio frequency interference (RFI) shielding is crucial to prevent unwanted signals from disrupting the performance of electronic devices.

EMI Filler

Conductive materials like copper, aluminum, metalized fabrics, elastomers, foams, and tapes are commonly used for EMI and RFI shielding. These materials are frequently converted to gaskets and other precise shapes that can include multiple layers of conductive and other materials.

Industry leaders like 3M™, Parker Chomerics, Saint-Gobain, Rogers Corporation, and Polymer Science provide a variety of EMI/RFI shielding materials that cater to different electronics applications.


Green Gaskets on a LinerGaskets, seals, and cushions provide protection against environmental elements like moisture, dust, vibration, and shock.

These solutions can be made for IP/NEMA Rated enclosures, ID/OD washers, lens gaskets, anti-vibration cushions, shock or impact absorbers, and more from materials such as Rogers PORON® foam, Rogers BISCO® silicones, Neoprene and EPDM rubber, polyethylene, and acrylic foam tapes.



Surface Protection FilmsSurface Protection Film

Thin films and surface protection materials temporarily safeguard electronic components from scratches, abrasions, and environmental damage during manufacturing and transit. Common applications requiring protection include display screens, touch panels, and other sensitive electronics surfaces.

Surface protection materials can be die-cut to tight tolerances, kiss-cut to a liner, and have tabs added when necessary, among many other value-added services.


Electrical Barriers/Insulation

Electrical insulation materials prevent electrical leakage along unintended paths, ensuring the safety and reliability of electronic devices.

Rotary Die-cut LED Electrical Insulator

Insulating materials include polyester (PET), rubber polymers, especially silicone, polypropylene, and fiber insulation (fish paper). Marian supplies materials manufactured by companies like ITW (manufacturer of ITW Formex®, a polypropylene insulation) and DuPont™, the supplier of Kapton® (Polyimide), Teijin Films (Melinex® and Mylar®), and Teflon™ (Chemours™ division), and 3M™ Flame Barrier FRB.

Electrical insulation materials are usually ultra-thin and lightweight, making them excellent for thin, lightweight devices. These materials can be further manufactured to include scoring, creasing, bending, folding, screen printing, and adhesive lamination as necessary.


Screen Printing for Electronics


Screen Printing/Overlays

Screen printing enhances the visual aesthetic of electronics devices, including control panel labels and custom branding elements. Selective lamination and strong adhesive backings can also be applied to custom print applications.



Along with guiding you to the best materials for your electronic device applications, Marian custom manufactures your parts to best fit your assembly processes. Our converting capabilities provide tailored solutions, ensuring electronics operate at their best while maintaining longevity and durability. Contact us today to see how we can assist with your custom, electronics solution.

Solutions for Electronic Applications



Topics: Thermal Management, Pressure Sensitive Adhesive, Foams, EMI Shielding, Surface Protection, Vent Material, die cutting, thermal pad, thermal interface material, gasket, Films, Electronics