Flexible Solutions

In the fast-paced world, electronics are now integrated into almost every aspect of human life. Solutions ensuring optimal performance and longevity are necessary to meet consumers’ expectations. Many converted electronic components are made using materials that address various challenges faced by electronics applications, including thermal management, electromagnetic interference (EMI), surface protection, and more.

Take a look below to see some of the custom solutions that enhance performance and function in applications with electronic components.

Combining Intricate Laminations to Create Multifunctional Parts

Electric vehicles (EVs) continue to experience a sharp growth trajectory, generating process advancements and additional application requirements and needs. Marian has developed improved solutions to meet the industry’s most critical necessities for battery longevity, performance, and passenger safety.

Below we examine some of these requirements and the complex, die-cut EV components Marian manufactures to overcome common challenges related to the battery.

Thermal gap pads are one common type of thermal management materials and are utilized in electronic devices within the interface, or gap, between a heat generating component and a heat sink. The heat sink or cooling plate is designed to conduct heat away from the heat generating component to keep it cool and running safely.

According to Parker Chomerics Thermal Management Engineering Handbook, the typical contact area between most semiconductors and heat sinks can be made up of 90% air voids! We also know that air is about 200 times less conductive than a 5 W/mK thermal interface pad. This is where the thermal gap pad comes in.

Thermal gap pads are made of soft polymer that flows into the air gaps in the interface to aid in the more efficient and effective conduction of heat.