Thermal gap pads are utilized in electronic devices within the interface, or gap, between a heat generating component and a
heat sink. The heat sink or cooling plate is designed to conduct heat away from the heat generating component to keep it cool and running safely. According to Parker Chomerics Thermal Management Engineering Handbook, the typical contact area between most semiconductors and heat sinks can be made up of 90% air voids! We also know that air is about 200 times less conductive than a 5 W/mK thermal interface pad.
This is where the thermal gap pad comes in.
Thermal gap pads are made of soft polymer that flows into the air gaps in the interface to aid in the more efficient and effective conduction of heat.
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Topics:
Thermal Management,
thermal pad,
thermal interface material
