Flexible Solutions

Custom Converted Solutions for Electronic Applications

Posted by Brook Girkin

Mar 4, 2024 1:00:00 PM

In the fast-paced world, electronics are now integrated into almost every aspect of human life. Solutions ensuring optimal performance and longevity are necessary to meet consumers’ expectations. Many converted electronic components are made using materials that address various challenges faced by electronics applications, including thermal management, electromagnetic interference (EMI), surface protection, and more.

Take a look below to see some of the custom solutions that enhance performance and function in applications with electronic components.

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Topics: Thermal Management, Pressure Sensitive Adhesive, Foams, EMI Shielding, Surface Protection, Vent Material, die cutting, thermal pad, thermal interface material, gasket, Films, Electronics

Why P-THERM® Gap Fillers Are Essential for EV Battery Design

Posted by Ben Hvidston

Nov 1, 2023 8:45:00 AM

The rapid advancement of the electric vehicle (EV) market is no secret, and to keep pace with this progress, OEMs seek cutting-edge thermal management solutions that perform well and come at a reasonable cost.

Among essential materials used for heat management in EV batteries, thermal gap fillers play a crucial role. Marian collaborates with suppliers like Polymer Science, whose partnership allows for development of high-quality gap filler materials along with various other essential materials for managing heat in electric vehicles.

We sat down with John Biddle, Vice President of Product Development at Polymer Science for a Q&A session where we delved into their contributions to the production of thermal management material and the benefits they bring to the EV world.

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Topics: Thermal Management, EV, battery, Material selection, thermal interface material, Electric Vehicle, Thermal Gap Filler Pads, Automotive, Polymer Science

The Best Thermal Gap Pad for Your Design

Posted by Katie Sullivan

Jul 29, 2020 9:30:00 AM

Thermal gap pads are utilized in electronic devices within the interface, or gap, between a heat generating component and a heat sink. The heat sink or cooling plate is designed to conduct heat away from the heat generating component to keep it cool and running safely. According to Parker Chomerics Thermal Management Engineering Handbook, the typical contact area between most semiconductors and heat sinks can be made up of 90% air voids! We also know that air is about 200 times less conductive than a 5 W/mK  thermal interface pad. This is where the thermal gap pad comes in.

Thermal gap pads are made of soft polymer that flows into the air gaps in the interface to aid in the more efficient and effective conduction of heat.

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Topics: Thermal Management, thermal pad, thermal interface material